Abstract
The chopping technique has been successfully used to enhance the adhesion of MgF2, ZnS and copper films. Chopping does not appreciably alter the adhesion of aluminium and chromium films. Chopping seems to increase the surface mobility of adatoms and prevent growth of large crystallites whereby producing more defect-free thin films because of higher relaxation leading to higher adhesion. The adhesion of chopped MgF2 and ZnS films compare well with those deposited on heated substrate and after glow discharge cleaning. The enhanced adhesion of copper films is being explained in terms of enhanced oxygen affinity at interface similar to that observed for aluminium and chromium. Chopping technique might provide a simple and cost effective process of depositing good adherent thin film coatings.
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