Abstract
The rapid advancement of artificial intelligence (AI) has propelled the demand for high-performance computing systems, leading to significant challenges in power and thermal management in advanced packaging for AI CPUs/GPUs. This research paper explores various strategies and technologies to address these challenges. It examines the principles and types of multi-die stacking technology, power optimization techniques, and advanced thermal management solutions. Furthermore, the paper discusses the integration of power and thermal management strategies and their synergistic effects. Case studies and numerical analyses highlight the effectiveness of these approaches in improving energy efficiency, performance, and reliability in AI semiconductor devices. The paper also identifies emerging technologies, such as heterogeneous integration and chiplet-based architectures, and outlines future directions for innovation in advanced packaging. Overall, by leveraging comprehensive research and collaboration, the semiconductor industry can drive the development of advanced packaging solutions that meet the growing demands of AI workloads and enable transformative advancements across industries and applications.
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