Abstract
The rapid advancement of artificial intelligence (AI) has propelled the demand for high-performance computing systems, leading to significant challenges in power and thermal management in advanced packaging for AI CPUs/GPUs. This research paper explores various strategies and technologies to address these challenges. It examines the principles and types of multi-die stacking technology, power optimization techniques, and advanced thermal management solutions. Furthermore, the paper discusses the integration of power and thermal management strategies and their synergistic effects. Case studies and numerical analyses highlight the effectiveness of these approaches in improving energy efficiency, performance, and reliability in AI semiconductor devices. The paper also identifies emerging technologies, such as heterogeneous integration and chiplet-based architectures, and outlines future directions for innovation in advanced packaging. Overall, by leveraging comprehensive research and collaboration, the semiconductor industry can drive the development of advanced packaging solutions that meet the growing demands of AI workloads and enable transformative advancements across industries and applications.
Sign-in/Register to access full text options 
Talk to us
Join us for a 30 min session where you can share your feedback and ask us any queries you have
Schedule a callMore From: International Journal For Multidisciplinary Research
Disclaimer: All third-party content on this website/platform is and will remain the property of their respective owners and is provided on "as is" basis without any warranties, express or implied. Use of third-party content does not indicate any affiliation, sponsorship with or endorsement by them. Any references to third-party content is to identify the corresponding services and shall be considered fair use under The CopyrightLaw.
