Abstract
In this paper, we discuss the potential foundry announced integration of magnetic random access memory (MRAM) on fully depleted silicon-on-insulator (FDSOI). The spin transfer torque magnetic tunnel junction (STT-MTJ) and the next-generation voltage-controlled magnetic anisotropy MTJ are separately integrated into a 28-nm FDSOI process as the MRAM or magnetoelectric random access memory (MeRAM)-on-FDSOI integration. Micromagnetic and electrical simulations are used to evaluate the performance of hybrid circuits. Circuit-level design strategies are explored that use FDSOI leverage and spin-device characteristic to realize writing and sensing power-delay efficiency, robust, and reliable performance in the one-transistor one-MTJ MRAM/MeRAM bit-cell and sensing circuits. Reliability issues are discussed. Process variation and aging resilience strategies, e.g., step-wise back-bias, flip-well re-configuration, and write assist, are proposed to address failure and aging degradation in the MRAM/MeRAM-on-FDSOI integration. A qualitative summary demonstrates that the MRAM/MeRAM-on-FDSOI integration offers attractive performance for future non-volatile CMOS integration.
Sign-in/Register to access full text options 
Talk to us
Join us for a 30 min session where you can share your feedback and ask us any queries you have
Schedule a callMore From: IEEE Transactions on Circuits and Systems I: Regular Papers
Disclaimer: All third-party content on this website/platform is and will remain the property of their respective owners and is provided on "as is" basis without any warranties, express or implied. Use of third-party content does not indicate any affiliation, sponsorship with or endorsement by them. Any references to third-party content is to identify the corresponding services and shall be considered fair use under The CopyrightLaw.
