Abstract

Thin film hybrid circuits usually are fabricated by photolithographic structuring of an evaporated or sputtered metal layer sequence (substractive technology). In contrast to this, we discuss the abilities of ‘‘evaporation masking,’’ i.e., evaporation through metal masks (additive technology). Its main advantage is the local deposition of several different materials (conducting, resistive, semiconducting, insulating, electroluminescent, etc.) enabling the production of multilayer thin film devices. In this work we emphasize the possibility of producing complex hybrid circuits in one vacuum cycle including local insulations for capacitors, crossovers, and passivating oxide layers. Moreover, we discuss the equipment used, the electrical properties of some standard materials (NiCr, Al, Al2O3, etc.) and the resulting design rules for the hybrid layout. As a typical example, a thin film hybrid circuit on 2×2 in. glazed ceramics is presented which includes 800 crossovers, 56 thin film resistors, and 3 evaporated capacitors.

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