Abstract
Additive manufacturing (AM) technologies are emerging fabrication methods that are expanding rapidly in both industrial applications and academic research. The most popular AM technologies are inkjet printing and three‐dimensional (3D) printing. This chapter first provides a detailed introduction to different AM technologies, including inkjet printing, and discusses a variety of 3D printing technologies and their relevance to radio frequency applications. Next, the material characterization methods are given, and a hybrid fabrication process by integrating 3D printed packaging substrates and inkjet printing conductive traces are introduced. The chapter also introduces a broadband 5G antenna‐in‐package (AiP) design realized with AM and the respective measurement results. Finally, the summary and future visions of realizing complex 3D AiP and system‐on‐package design using AM are included.
Sign-in/Register to access full text options 
Free) 
Talk to us
Join us for a 30 min session where you can share your feedback and ask us any queries you have
Schedule a call
