Abstract
In real trench MOS barrier Schottky diode (TMBS diode) additional electric field (AEF) the whole is formed in the near contact region of the semiconductor and its propagation space is limited with the barrier metal and the metallic electrodes of MOS structures. Effective potential barrier height TMBS diode is formed via resulting electric field of superposition AEF and electric field of space charge region (SCR) semiconductor. The dependence of the resulting electric field intensity of the distance towards the inside the semiconductor is nonlinear and characterized by a peak at a certain distance from the interface. The thickness of the SCR in TMBS diode becomes equal to the trench depth. Force and energy parameters of the AEF, and thus resulting electric field in the SCR region, become dependent on the geometric design parameters TMBS diode. The forward I-V characteristic TMBS diode is described by the thermionic emission theory as in conventional flat Scottky diode, and in the reverse bias, current is virtually absent at initial voltage, appears abruptly at a certain critical voltage.
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