Abstract
Active Through-Silicon Interposer (ATSI) based 2.5D/3D IC packaging is a solution to extend Moore's law beyond the limitations inherent in 2D packages. We present the implementation of an ATSI platform for providing Analog to Digital converter (ADC), Digital to Analog converter (DAC) and embedded Power Management Unit (ePMU) functions to support high performance logic, fabrication of 140 micron pitch Via-Last Through-Silicon Via (TSV) of 40 micron height, assembly of Chip-on-Chip-on Substrate, functional test and reliability assessment. The active interposer fabricated in 130nm CMOS easily supports the I/O, Analog, Electro Static Discharge (ESD), De-cap functions with via-last TSV. This approach enables significant die-size reduction of the top die (usually in expensive 16nm CMOS or below tech. node) to achieve system miniaturization and cost reduction
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