Abstract

Several studies have reported about power semiconductors and capacitors being the most sensitive components in power converters. The lifetime of these devices is associated with the mission profile and the resulting temperature profile. For preventing failures, it is of interest to estimate the Remaining Useful Lifetime(RUL) and several condition monitoring methods have been proposed for this purpose. Moreover, modular power converters consist of a high number of components and methods have been proposed to reduce the thermal stress and therefore extend the lifetime of a system with software, referred to as active thermal control. For power converters with limited accessibility, the RUL detected by the condition monitoring system may not fit to the scheduled maintenance of the system and devices may still have a significant RUL when their replacement is scheduled. Therefore, this work proposes to control the stress of the most deteriorated components in the system such that the failure probability of multiple building blocks is equalized when the next maintenance is scheduled. Moreover, this concept is proposed to extend the time to the next maintenance and reduce the number of maintenance instances without affecting the mean lifetime of the system.

Highlights

  • Power electronics is consolidated in a wide range of application fields such as variable speed drives, electric vehicles and renewable energy systems

  • Power semiconductors and capacitors have been found to be the devices, which are most prone to failure[4]

  • Their failure mechanisms are well understood and several condition monitoring techniques have been proposed for these devices[5]

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Summary

Introduction

Power electronics is consolidated in a wide range of application fields such as variable speed drives, electric vehicles and renewable energy systems. Power semiconductors and capacitors have been found to be the devices, which are most prone to failure[4] Their failure mechanisms are well understood and several condition monitoring techniques have been proposed for these devices[5]. In the worst case different devices fail at similar time instances and the system will be shut down This is targeted to be prevented with condition monitoring techniques, which predict the RUL[6]. This work proposes to apply condition monitoring for capacitors and power electronics and combine this information with thermal control for RUL equalization and lifetime extension. Active methods to increase the reliability of power semiconductors and capacitors are studied in section 3 and the application of this concept for delaying maintenance is introduced, where two study cases are presented.

Condition monitoring
Condition monitoring and lifetime estimation of power electronics modules
Condition monitoring and lifetime estimation of electrolytic capacitors
Active thermal control for lifetime manipulation
Active thermal control by means of power routing
Active capacitor voltage ripple reduction
Thermal control for delaying maintenance
Health based thermal control of an electrical drive
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