Abstract
ZnS–SiO2 targets have been directly soldered to copper backing plates at 180°C in air using an Sn56Bi4Ti(Ce, Ga) filler. The affinity of cerium to oxygen protects titanium from oxidation, allowing titanium to react with ZnS–SiO2 sputtering target. The shear strengths are 1.7, 8.7, and 1.3 MPa for ZnS–SiO2/ZnS–SiO2, copper/copper and ZnS–SiO2/copper joints, respectively. EPMA elemental mapping shows that aging test at 120° for 100 hours enhanced the segregation of titanium at the ZnS–SiO2/solder interfaces. The shear strength of ZnS–SiO2/copper joint after aging test is 1.3 MPa that shows no trace of degradation compared to the initial quality of the samples.
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