Abstract

Active atomic force microscope cantilevers with on-chip actuation and sensing provide several advantages over passive cantilevers which rely on piezoacoustic base-excitation and optical beam deflection measurement. Active microcantilevers exhibit a clean frequency response, provide a path-way to miniturization and parallelization and avoid the need for optical alignment. However, active microcantilevers are presently limited by the feedthrough between actuators and sensors, and by the cost associated with custom microfabrication. In this work, we propose a hybrid cantilever design with integrated piezoelectric actuators and a piezoresistive sensor fabricated from the silicon device layer without requiring an additional doping step. As a result, the design can be fabricated using a commercial five-mask microelectromechanical systems fabrication process. The theoretical piezoresistor sensitivity is compared with finite element simulations and experimental results obtained from a prototype device. The proposed approach is demonstrated to be a promising alternative to conventional microcantilever actuation and deflection sensing.

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