Actinic Mask Blank Inspection and Signal Analysis for Detecting Phase Defects Down to 1.5 nm in Height

Abstract

The capability of an actinic (at-wavelength) inspection system for extreme ultraviolet lithography (EUVL) mask blank has been analyzed by experiment and simulation. The actinic inspection optics, that we developed to obtain a two-dimensional dark field image, consists of illumination optics, Schwarzschild optics with concave and convex mirrors as dark-field imaging optics, and a back-illuminated charge-coupled-device (BI-CCD). A test mask blank with programmed bump defects of smaller sizes and lower heights compared to those used in a previous work was fabricated and the bump defects were detected by the tool. The inspection experiments demonstrated that fabricated multilayer defects down to 1.5 nm in top height and 60 nm in width can be successfully detected. The simulation further indicated that the inspection optics performed well in detecting phase defects of 1.5 nm in height and 40 nm in width.