Abstract
The authors report on acoustic attenuation measurements in transparent thin films by picosecond ultrasonics. This ultrafast technique has already been proposed for such measurements but usually attenuation is overestimated and a specific sample configuration is needed. Here they present another way of using this technique which overcomes both difficulties. Experimental results obtained for silica show a very good agreement with literature. This validates the protocol which is then applied to various other materials used in microelectronics.
Talk to us
Join us for a 30 min session where you can share your feedback and ask us any queries you have
Disclaimer: All third-party content on this website/platform is and will remain the property of their respective owners and is provided on "as is" basis without any warranties, express or implied. Use of third-party content does not indicate any affiliation, sponsorship with or endorsement by them. Any references to third-party content is to identify the corresponding services and shall be considered fair use under The CopyrightLaw.