Achieving high thermal conductivity and strong bending strength diamond/aluminum composite via nanoscale multi-interface phase structure engineering

Abstract

Diamond/aluminum composites, as a new generation of thermal management materials, are caught in the dilemma between inhibiting the formation of Al4C3 and improving the performance. Herein, we proposed a strategy for nanoscale multi-interface phase structure engineering, utilizing a combination of magnetron sputtering and vacuum heat treatment to obtain diamond particles with nanoscale TiC-Ti layers. Prolonging the vacuum heating time increases the content of TiC, but results in significant differences in the morphology and coverage of TiC formed on the diamond(100) and (111) facets. First-principles calculations reveal that the work of adhesion and C-Ti reaction tendency of diamond(100)/Ti are stronger than those of diamond(111)/Ti, clarifying the difference in interfacial properties between diamond/Ti and diamond/TiC. Diamond-TiC-Ti configuration obtained in advance contributes to fabricating the composite with diamond-TiC-Al(Al3Ti) structure, and the multi-interface phase structure is beneficial to improve the interface bonding, adjust the acoustic mismatch, and inhibit the formation of Al4C3. (800 °C 0.5 h)@Ti-coated diamond(100 μm)/aluminum composite with the multi-interface phase exhibits excellent thermal conductivity(646 W m−1 K−1) and outstanding bending strength(358 MPa), exceeding 90 % of the theoretical prediction of the differential effective medium model. The performance of (800 °C 0.5 h)@Ti-coated diamond/aluminum composite is about 30 % higher than that of traditional Ti-coated diamond/aluminum composite. The TiC layer formed by increasing the heat treatment time is thicker and discontinuous, leading to a decrease in the thermal conductivity of the composite and a weakening effect of Al4C3 inhibition. We clarified the formation mechanism of interface structure related to diamond orientation by multi-scale characterization. Based on the thermal conductivity prediction models, the interface structures corresponding to different diamond orientations were considered, and the predicted values showed good consistency with the experimental results. By interface modification engineering, we overcome the dilemma of introducing modified layer to inhibit Al-C reaction while leading to additional interface thermal resistance, providing insights into the interfacial thermal transport mechanism.