Abstract
BackgroundThe replacement of lead (Pb)-bearing solders by several Pb-free solders is a subject of intense research in these days due to the toxic effects of Pb on the environment. However, the Pb-free solders contain metals such as silver (Ag), copper (Cu), and zinc (Zn). The increasing use of these Pb-free solders again increases the risk of release of Ag, Cu, and Zn metals into the environment. The Pb-free solders can, therefore, be used as a secondary source for the metals which will not only help in environmental protection but also for the resource recovery.ResultsThis study reports a process to leach metals from hazardous soldering materials by acetic acid. Acetic acid was found more effective for metal recovery from the tin–copper (Sn–Cu) solder than tin–copper–silver (Sn–Cu–Ag) solder. Various process parameters were optimized for recovery of metals from Sn–Cu solder. It required 30 h for 100% recovery of Cu and Sn, respectively. The metal recovery increased gradually with an increase in acid concentration approaching complete recovery at an acid concentration of 80%. Effect of shaking speed and temperature on the recovery of metals from Sn–Cu solder was studied. The metal recovery decreased with an increase in solder weight.ConclusionThe present study reveals an effective process to recycle the Pb-free solders. The low concentration of acetic acid was also found significant for metal leaching from solder. The research provides basic knowledge for recovery of metals from Pb-free solders.
Highlights
The replacement of lead (Pb)-bearing solders by several Pb-free solders is a subject of intense research in these days due to the toxic effects of Pb on the environment
The basic experimental results for the metal leaching from Sn–Cu and Sn–Cu–Ag solders by acetic acid In the present study, two types of solders Sn–Cu and Sn–Cu–Ag were used
A 34 (± 1.05) and 49 (± 0.1)% metal leaching was achieved for Cu and Sn, respectively, using 4% acetic acid with 100/10 solid-to-liquid ratio (Fig. 2b). These results suggest that both the hydro- and biohydrometallurgical processes can be established depending on the concentration of acetic acid used, for leaching of metals from Pb-free solders
Summary
The replacement of lead (Pb)-bearing solders by several Pb-free solders is a subject of intense research in these days due to the toxic effects of Pb on the environment. The increasing use of these Pb-free solders again increases the risk of release of Ag, Cu, and Zn metals into the environment. Lead is known to be a toxic material. It has health and environmental concern (Yoo et al 2016). There is an increasing demand in replacing Sn/Pb solders with Pb-free solders in the electronics industry (Cheng et al 2011). The replacement of Pb-bearing solders by several Pb-free solders can avoid potential environmental risk from toxic Pb elements.
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