Abstract
Oxide breakdown is one of the most threatening failure mechanisms in integrated circuits. As the oxide thickness is decreased in the sub-5-nm range, the breakdown definition, itself is no longer clear and its detection becomes problematic. A new algorithm for accurate and robust automatic triggering on soft breakdown (SBD) during constant voltage stress based on gate current noise increase is presented. Triggering on current spikes or pre-BD events is avoided. This test assures correct automatic SBD detection in a wide range of stress conditions and various geometries, with an execution speed that provides acceptable time resolution.
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