Abstract

The paper introduces recent collaboration between Tohoku University and industry in MEMS (micro electro mechanical systems) field. The selected examples of devices are an integrated network tactile sensor for robot applications, a tunable SAW (surface acoustic wave) filter for TV white space cognitive WiFi communication and an anodically-bondable LTCC (low temperature cofired ceramic) wafer for wafer-level hermetic MEMS packaging. In the last part of this paper, multi-leveled shared MEMS facilities available for industrial collaboration are summarized. The most important message here is that we are strongly motivated to contribute to industry in multiple manners.

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