Abstract

${\mathrm{Bi}}_{2}{\mathrm{Sr}}_{2}\mathrm{CaCu}{\mathrm{O}}_{x}$ (Bi-2212) is the only high-${T}_{c}$ superconductor (HTS) available as a multifilamentary round wire with multiple architectures and it is a very promising conductor for the realization of high-field applications. Despite their relatively simple wire fabrication by the powder-in-tube technique, Bi-2212 wires require a tightly controlled overpressure heat treatment (HT) with a multiparameter time-temperature schedule to achieve high critical current density, ${J}_{c}$. The variation of these HT parameters, changes in the wire design, wire diameter, and powder quality can lead to variations in both the microstructure and the superconducting performance. Particularly noticeable are variations in ${J}_{c}$ performance and degree of filament bridging. In this work, we focus on the use of different magnetic characterization techniques to estimate the bridging level and assess the balance of intergrain and intragrain superconducting properties including the irreversibility field (${H}_{\mathrm{irr}}$) and the pinning energy (${U}_{o}$) in differently processed wires. Regardless of the actual bridging level, we find that the supercurrent flows at the filament bundle level, not just at the individual filament level. Moreover, using ac susceptibility we identify two distinct supercurrent contributions, one related to the intragrain and one to the intergrain properties, whose irreversibility fields are different but without large sample-to-sample variation. Moreover, an additional component of intragrain pinning mechanism becomes effective at low temperatures with positive effects also on the intergrain performance. The work clearly shows that detailed magnetic characterizations can become valuable tools to investigate the performance of differently processed Bi-2212 wires, correlating their microstructure and overall transport ${J}_{c}$, to obtain a deeper understanding of the causes of performance variation and paths to achieve further improvement.

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