Abstract

Understanding and mitigating effects of radiation are central to ensure reliable, long-term operation in space and strategic environments for compound semiconductor based electronics. A multiscale modeling approach has been employed to reveal the damage process and explore radiation resistance mechanisms in HgTe. Contrary to general belief, direct-amorphization and fast migration of interstitials within amorphous pockets provide a dominant driving force for rapid defect recovery, thus significantly enhancing radiation resistance. This study provides a precursor for developing predictive capabilities in designing and enabling radiation resistance with confidence for robust semiconductors.

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