Abstract
Radio frequency Ar and plasma jets generated in a hollow electrode terminated by a small size Ti nozzle were used for deposition of Ti and films. The regime with low content of reactive gas resulted in an extreme enhancement of deposition rate, more than one order higher than that of Ti. Abrupt increase of the nozzle temperature to >1350°C in this regime is caused by additional thermal energy imparted to the nozzle. Abrupt decrease of the cathode dc self‐bias and simultaneous steep increase of the optical emission from Ti and from ions Ti+, , and Ar+ indicate the transition of the discharge into the RPJ‐arc. This reflects in an enhanced production of Ti and Ti+ which leads to a high rate (≈μm/min) growth of films. The microhardness of films at low nitrogen content is and the film resistivity is 80 μΩ cm. Geometry of the particle transport and the distribution of the, film thickness on substrates confirm a hollow profile of the particle density distribution in the plasma jet.
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