Abstract

Extreme ultraviolet lithography (EUVL) presents promise for the advanced technology node in the manufacturing of integrated circuits. The imaging performance of EUVL is significantly affected by the aberration of projection optics. To obtain one optimum aberration for different test patterns, an inverse optimization method for aberration is proposed in this paper. The aberration models of three types of test patterns are first established by applying the backpropagation (BP) neural network. Then choosing the common indicators of the lithography process variation band (PVB) and pattern shift (PS) as the objective function, an aberration optimization method based on the algorithm of simulated annealing is proposed. After applying the optimization method, a set of optimized aberrations and the corresponding PVBs and PSs are obtained and analyzed. These results are finally compared with those from rigorous simulations. The comparison results show that zero aberration is non-optimal distribution in EUVL image simulation with mask topography. In addition, the high prediction accuracy and robustness of aberration optimization is also demonstrated from the results.

Full Text
Paper version not known

Talk to us

Join us for a 30 min session where you can share your feedback and ask us any queries you have

Schedule a call

Disclaimer: All third-party content on this website/platform is and will remain the property of their respective owners and is provided on "as is" basis without any warranties, express or implied. Use of third-party content does not indicate any affiliation, sponsorship with or endorsement by them. Any references to third-party content is to identify the corresponding services and shall be considered fair use under The CopyrightLaw.