Abstract
AbstractThe fourth dimension in 4D printing comprises the ability of materials to recover their shape with time by utilizing 3D printing in combination with shape memory polymers. The focus of this work is on 3D printing of physically crosslinked thermoplastic polymers, which allow a reversible transformation from a temporary to an original shape by an external stimulus temperature, thus realize 4D printing. In this context, (AB)n segmented copolyetherimides consisting of perylene and poly(ethylene glycol) (PEG) segments are synthesized and characterized regarding their thermal and rheological properties in view of 3D printing. The perylene imide segments act as reversible physical crosslinks which disassemble between 100 and 200 °C. The PEG segments exhibit a low melting temperature around 40 to 60 °C and are semi‐crystalline at room temperature. The results show that this type of (AB)n segmented copolyetherimide combines reliable 3D printing performance, which is indicated by low warp deformation and excellent interlayer bonding. With a blend of two copolymers, it is able to realize 4D printing.
Highlights
The fourth dimension in 4D printing comprises the ability of materials to interlayer bonding quality.[5]
The results show that this type materials and 3D printing is reported of (AB)n segmented copolyetherimide combines reliable 3D printing performance, which is indicated by low warp deformation and excellent interlayer bonding
To provide materials for extrusion-based 3D printing with the additional feature of a shape memory effect, the polymer requires two separated transitions at different temperatures, Ttrans.(low) and Ttrans.(high)
Summary
To provide materials for extrusion-based 3D printing with the additional feature of a shape memory effect, the polymer requires two separated transitions at different temperatures, Ttrans.(low) and Ttrans.(high) In this respect, the (AB)n segmented copolye therimides 1a and 1b (Figure 1) consist of polyethylene glycol segments which should crystallize above room temperature and of perylene bisimide segments which should form physical crosslinks via π–π interactions at higher temperatures. In contrary to 1b, 1a exhibits a pronounced transition at around 50–70 °C which is assigned to the disassembly of the perylene bisimide segments (Ttrans.(high)) For both 1a and 1b, a steep increase in viscosity is observed around 10 and 40 °C, respectively, corresponding well with the crystallization temperatures of the PEG segments as measured by DSC (Ttrans.(low)). Tensile tests of injection-molded filament rods were carried out
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