Abstract
Natural convective heat transfers on IC package type resistance elements were made clear by the experiments in silicone oil. Temperature distribution and flow pattern of natural convection around resistance elements on the vertical circuit board in silicone oil were made visiable with the liquid crystal particle suspension method. Natural convection around resistance elements were affected by the array of resistance elements on the vertical board. Thermal boundary layer and thermal plume around resistance elements were made clearly observation. The natural convective heat transfer performances were affected both resistance elements with each others.
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