Abstract
In recent years, the heat flux of electronic devices has significantly increased due to higher output and downsizing. A JEST type Loop Heat Pipe with a water-cooled heat exchanger has been developed. In the present study, the total thermal resistance was divided to each part of the equipment, and the effect of each thermal resistance on the cooling performance was investigated. As a result, the effect of vapor line inner diameter on the total thermal resistance was clarified. And it was also revealed that the evaporator thermal resistance was 65% of the total thermal resistance. Therefore, an approach to decrease the evaporator thermal resistance is effective for improving the cooling performance.
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