Abstract

Light transmission through wheat (T. aestivum L.) grain longitudinal cross sections of different thickness was used to study the endosperm microstructure and was shown to strictly follow a Beer-Lambert law allowing a non ambiguous quantification of the endosperm vitreousness. Therefore similar samples obtained from near-isogenic lines differing by hardness and grown in two distinct environments affecting their vitreousness were analyzed and confirmed the relationship between light transmission and the endosperm microstructure. In each sample, moreover analysis of light transmission within the different grain parts highlighted the greater compactness of the central endosperm cheeks in comparison with the distal and the proximal regions. These results helps a better understanding of the endosperm microstructure.

Highlights

  • The protein-starch adhesion and the microstructure of the common wheat 3 (Triticum aestivum L.) starchy endosperm were found to differ depending on 4 genetic and environmental factors [1]

  • Wheat grains 63 Near-isogenic lines (NIL) of Triticum aestivum L. were produced by Insti64 tut National de la Recherche Agronomique (INRA) and displayed either the wild-type Pinb-D1a or the mutated Pinb-D1b allele, which respectively conferred to grains the soft or the hard phenotype

  • Wheat samples were selected from a previous study [15].This study drove us to select grains with a defined puroindoline genome leading to either soft or hard phe116 notype and grown in two contrasted environments resulting in different levels 117 of vitreousness for the starchy endosperm

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Summary

Introduction

The protein-starch adhesion and the microstructure of the common wheat 3 (Triticum aestivum L.) starchy endosperm were found to differ depending on 4 genetic and environmental factors [1]. These factors are both found to af fect the grain mechanical resistance i.e. endosperm hardness [2] and 6 play a key role in grain milling behavior. Translocation of the wild type puroindoline genes in a durum background [8], which lacks D genome, leads to mechanical resistance and similar character istics to soft common wheat i.e. a higher production of the finest particles with low starch damage after milling [9, 10, 11]. In25 deed recent studies showed mechanical changes at the interface using near-

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