Abstract
The thermal management is important not only for semiconductor components, but for discrete capacitors as well. In this paper a new measurement setup is presented that adopts the thermal transient measurement technique for capacitor components. The measurement method is demonstrated on a through-hole ceramic capacitor and validated using CFD simulations. It is also shown that using the structure function the simulation model parameters can be fine-tuned to provide a transient response that is matching the measured data.
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