Abstract
In this paper, a wafer-scale gold-to-gold thermo-compression bonding packaging based on an RF distributed MEMS transmission line (DMTL) phase shifter is proposed. The DMTL phase shifter, based on a coplanar waveguide (CPW), has symmetrical saw-shaped structures in the CPW signal line under the MEMS bridge and an insulation layer in the middle of the structures. Two Si wafers are bonded together using gold-to-gold thermo-compression bonging with one as the cap wafer and the other as the substrate wafer which embodies RF DMTL phase shifter. A CST software is used for the modeling, simulation and optimization from 30 to 40GHz. Results show that the proposed design, with a 35GHz central resonant frequency, has a return loss less than -10dB within 2.4GHz bandwidth range and for each RF MEMS switch-type bridge, as high as 60 degrees phase shift is realized. Compared with the naked MEMS phase shifters, the return loss can be improved by 3dB, and the performance of phase shift remains almost the same.
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