Abstract

SAMSUNG ELECTRONICS AND Siltronic, the silicon wafer business of Germany's Wacker Chemie, are forming a joint venture to construct a $1 billion plant in Singapore for 300-mm silicon wafers. Construction is set to begin in August, following relevant regulatory approvals, and is expected to be completedby mid-2008. The firms say the plant's output will reach 300,000 wafers per month by 2010. Both companies will operate the 50-50 joint venture, which will be located near an existing Siltronic facility. Siltronic's parent, Wacker, will supply hyperpure porycrystalline silicon raw material for the wafers. In electronics manufacturing, many semiconductor chips are made at one time on a single silicon wafer. The semiconductor industry has been gradually replacing 200-mm wafers with 300-mm wafers as a way to increase chip output. Samsung says the new plant will provide a steady supply of 300-mm wafers for its own semiconductor fabrication. A first in the wafer industry, this ...

Full Text
Published version (Free)

Talk to us

Join us for a 30 min session where you can share your feedback and ask us any queries you have

Schedule a call