Abstract
A broadband transition structure from rectangular waveguide (RWG) to microstrip line (MSL) is presented for the realization of the low-loss packaging module using Low-temperature co-fired ceramic (LTCC) technology at W-band. In this transition, a cavity structure is buried in LTCC layers, which provides the wide bandwidth, and a laminated waveguide (LWG) transition is designed, which provides the low-loss performance, as it reduces the radiation loss of conventional direct transition between RWG and MSL. The design procedure is also given. The measured results show that the insertion loss of better than 0.7 dB from 86 to 97 GHz can be achieved.
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