Abstract
The ever increasing demand for smaller devices is creating a new set of performance and reliability problems. Overcoming these problems requires sophisticated device structures incorporating advanced knowledge of device physics coupled with improved process uniformity and precision. Fabrication of such structures in silicon and compound semiconductors is generating demands for new process technology. An ion implanter has been designed specifically for improvement of process control and construction of advanced three-dimensional device structures. The instrument uses a programmable goniometer as the target positioning system. This versatile end station, combined with a sophisticated automation and control system, is designed to meet the emerging requirements for flexible target positioning and repositioning for both planar and 3D structures. Details of the design of this new ion implanter are described and performance specifications are presented.
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