A universal high-efficiency cooling structure for high-power integrated circuits☆

Abstract

• A novel micro-channel heat sink(GFSMs MCHS) and an electronic cooling structure(3D-HDS) are designed. • GFSMs MCHS can reduce thermal resistance of regular MCHS by more than 57%. • The thermal resistance of GFSMs MCHS can be reduced to below 0.15 with a pump power of 0.04 W. • 3D-HDS can reduce the thermal resistance and MATD (mean absolute temperature difference) of regular MCHS by more than 40%. Nowadays, the growing number of electronic components in integrated circuit(IC) chips require higher cooling efficiency. Here we propose a universal efficient cooling structure based on Micro-Channel Heat Sink (MCHS), which can be applied to heat dissipation of IC chips with uniform and non-uniform heat fluxes. When using GFSMs (Gradually-Higher Fins Spilt-Flow Microstructures) MCHS to cool an IC chip with a uniform heat flux of 100 W/cm 2 , the thermal resistance and MATD (mean absolute temperature difference) of regular MCHS can be reduced by 57% and 77%. At the same time, the GFSMs MCHS can reduce the thermal resistance to less than 0.28 K/W with only 1/4 of the pressure drop of the regular MCHS, and the thermal resistance can be reduced to below 0.15 K/W with a pump power of 0.04 W. In addition, TTSV (Thermal Through Silicon Via) is combined with a split-flow microstructure to form a three-dimensional heat dissipation structure (3D-HDS). When using 3D-HDS MCHS to cool a chip containing a 1250 W/cm 2 heat flux hotspot, simulations show that the thermal resistance and MATD decreased by more than 40% compared to regular MCHS. The cooling structure will have broad application prospects in the field of high-power integrated circuits and electronic cooling.