Abstract
Charge damage considerations are prompting the development of neutral beam sources for etching applications. Anisotropic etching with hyperthermal Cl2 and SF6 beams has been demonstrated. We describe a two-dimensional plasma chemistry fluid model of laser ablation of frozen Cl2 in vacuum as a neutral beam source. In this scheme an externally applied electric field would be used to enhance the dissociation rate of Cl2 potentially providing an enhanced Cl content in the beam for a greater etch rate. Laser ablation generated neutral beams also may contain a desirable and controllable ion content which may be used to further enhance the etch rate. Limitations of the concept are discussed.
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