Abstract
A two‐dimensional computer simulation for electroless copper deposition was carried out using a Monte Carlo method. The equilibrium adsorption constants of ligands and Cu(II) ligand complexes on a substrate were calculated for three ligands, ethylenediaminetetraacetic acid, N,N,N′,N′‐tetrakis(2‐hydroxyethyl)ethylenediamine, and triethanolamine. The calculated equilibrium adsorption constants agreed well with the experimental results. Microvoid fractions in the plating structure were also estimated based on the equilibrium adsorption constants. The void fraction was useful in evaluating the fatigue ductility of copper plating.
Sign-in/Register to access full text options 
Talk to us
Join us for a 30 min session where you can share your feedback and ask us any queries you have
Schedule a callDisclaimer: All third-party content on this website/platform is and will remain the property of their respective owners and is provided on "as is" basis without any warranties, express or implied. Use of third-party content does not indicate any affiliation, sponsorship with or endorsement by them. Any references to third-party content is to identify the corresponding services and shall be considered fair use under The CopyrightLaw.
