Abstract
A facility for depositing thin films in a transverse high-frequency discharge is described. The facility consists of two (basic and auxiliary) chambers. The basic chamber is intended for sputtering targets and depositing a thin film on the prepared substrate. The auxiliary chamber contains a system of replaceable electrodes and serves for the preliminary processing of a substrate and the subsequent action on the thin film obtained. The device was tested in an oxygen discharge at pressures of 1.0 to 15 hPa and a deposited specific high-frequency power of up to 6.5 W/cm3 at a frequency of 10 MHz with targets of Pb(Zr x Tix– 1)O3 ferroelectric ceramics and showed satisfactory results.
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