Abstract
A triple channel HEMT structure grown on InP has been developed (the "Camel" HEMT). Starting from a dual channel (InGaAs/InP) HEMT that utilizes both the high electron mobility of InGaAs and the low impact ionization coefficient of InP, a third InGaAs channel as well as a quaternary carrier supply layer have been introduced to improve the electron transfer and thus the transistor performance. The design of the new transistor structure and its fabrication technology are described. Static and dynamic performances for an 0.8 /spl mu/m gate length Camel HEMT are presented and compared to standard double channel HEMT transistors that are fabricated with the same geometry and process conditions. The results show that this new structure offers a very good tradeoff between high breakdown voltage and current gain cutoff frequency.
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