A transfer method for complex structures fabricated on non-planar surfaces

Abstract

A method to fabricate complex structures on non-planar surfaces by utilizing a transfer method is presented. 3-dimensional and high-aspect-ratio microelectromechanical systems (MEMS) structures are transferred to flexible membranes, and can be further transferred to any non-planar surfaces. Here, we used a structure formed on a silicon-on-insulator (SOI) wafer by deep reactive-ion etching (DRIE) as an example. Both photoresist SU8-2050 and AZ 4620 were used as the flexible membranes. The effect of the structure and density of pillars on the transferring procedure was studied. Potentially this method could be utilized to transfer any MEMS structures and devices to any non-planar surfaces, thus possessing great potential in MEMS devices.