A time-domain physics-of-failure model for the lifetime prediction of wire bond interconnects

Abstract

A new physics-of-failure lifetime prediction model for wire bonds is proposed. It discards the usual cycle-dependent modeling methodology and is instead based on a time domain representation. The bonding interface damage condition is estimated at regular time intervals through a damage model which includes the effect of temperature and time dependent material properties. Thus the impact of time at temperature and other rate sensitive processes on the bond degradation rate can be accurately represented. In addition, the model accounts not only for the damage accumulation processes but also the damage removal phenomena during thermal exposure.