A three-dimensional oscillating heat pipe filled with liquid metal and ammonia for high-power and high-heat-flux dissipation

Abstract

With the rapid development of microelectronics technology, the power of some advanced electronic devices has reached 1000 W with heat flux of 100 W/cm2. The problem of high-power and high-heat-flux thermal management has become the bottleneck of the development of advanced electronic devices. In this paper, a three-dimensional oscillating heat pipe (3D-OHP) with 18 channels was developed for this problem. A new hybrid fluid of ammonia and liquid metal was used as a working fluid. The wall temperature and heat transfer performance of the 3D-OHP charged with the hybrid fluid were investigated experimentally. The results indicate that the 3D-OHP can effectively solve the problem of heat dissipation with the heating power of 1000 W and the heat flux of 111.1 W/cm2. Liquid metal can ensure the efficient operation of ammonia OHP under supercritical pipe diameter, and promote the working fluid to form a unidirectional flow. Liquid metal has a great ability to absorb and release heat which significantly enhances the heat transfer performance of the 3D-OHP. When the heat flux reached 111 W/cm2, the 3D-OHP with 2.11% liquid metal had the best heat transfer performance, and the thermal resistance was 0.0351 °C/W. Compared with pure ammonia 3D-OHP, it could reduce the temperature difference of the 3D-OHP by 9.1 °C and enhance the heat transfer performance by 20.57%. The capacity of the ammonia-liquid metal 3D-OHP to deal with high-power and high-heat-flux is higher than the existing studies.