Abstract
With high power density, fast charging-discharging speed, and a long cycling life, supercapacitors are a kind of highly developed novel energy-storage device that has shown a growing performance and various unconventional shapes such as flexible, linear-type, stretchable, self-healing, etc. Here, we proposed a rational design of thin film, flexible micro-supercapacitors with in-plane interdigital electrodes, where the electrodes were fabricated using the oblique angle deposition technique to grow oblique Ni/NiO nanowire arrays directly on polyimide film. The obtained electrodes have a high specific surface area and good adhesion to the substrate compared with other in-plane micro-supercapacitors. Meanwhile, the as-fabricated micro-supercapacitors have good flexibility and satisfactory energy-storage performance, exhibiting a high specific capacity of 37.1 F/cm3, a high energy density of 5.14 mWh/cm3, a power density of up to 0.5 W/cm3, and good stability during charge-discharge cycles and repeated bending-recovery cycles, respectively. Our micro-supercapacitors can be used as ingenious energy storage devices for future portable and wearable electronic applications.
Highlights
With the rapid development of miniaturized electronic devices in recent years, there are great demands for flexible and micro energy storage devices at the same time
The shadowing effect introduces preferential growth on taller surface heights, and enhances the island formation, even in the absence of surface diffusion, which does not exist at normal incidence [21]
In-plane MSCs with versatile patterns based on interdigital, ultra-thin, and highly integrated electrodes are obtained by directly photolithography, and successively depositing NiO nanowire arrays by an oblique angle deposition technique
Summary
With the rapid development of miniaturized electronic devices in recent years, there are great demands for flexible and micro energy storage devices at the same time. The in-plane interdigital MSC, which has interdigital shape electrodes with many dense micro fingers on a thin film substrate, was popular among many kinds of flexible MSCs. Compared with other types of MSCs, this type of flexible in-plane interdigital MSC can be prepared by traditional device processing technology to achieve a high specific surface area, small size, and high capacitance, and does not require complicated fabrication processes, multiple steps, or high cost. Compared with other types of MSCs, this type of flexible in-plane interdigital MSC can be prepared by traditional device processing technology to achieve a high specific surface area, small size, and high capacitance, and does not require complicated fabrication processes, multiple steps, or high cost These superiorities render in-plane interdigital MSCs as powerful candidates for application in miniaturized portable electronic devices
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