Abstract
Low thermal resistance and high TCT (temperature cycle test) reliability have been attained by thin AlN BGA package structure. High speed signal transmission for multimedia DSP (digital signal processor) has been analyzed by computer simulation. The package has 0.6 mm body thickness, which is 1/3 of ordinary ceramic packages. A low thermal resistance of 4.8 /spl deg/C/W has been attained without a heat sink and with no air cooling while mounted on a PWB having 4 conductive layers. Scattering parameters were measured up to 9 GHz and applied to 250 MHz clock signal simulation. No deterioration of signal waveforms was observed during the simulation. The effects of package thickness and package size have been discussed from the thermal resistance and TCT reliability point of view. Thicker and larger package size provided lower thermal resistance. The developed package thickness and size (35/spl times/35 mm) have been determined by taking into account the application field of mobile PCs (personal computers) and through simulation. The package thickness versus TCT reliability has been discussed, and then the TCT has been carried out under an assembled condition on a PWB, and MTTF of 1 k cycles has been derived.
Sign-in/Register to access full text options 
Talk to us
Join us for a 30 min session where you can share your feedback and ask us any queries you have
Schedule a callDisclaimer: All third-party content on this website/platform is and will remain the property of their respective owners and is provided on "as is" basis without any warranties, express or implied. Use of third-party content does not indicate any affiliation, sponsorship with or endorsement by them. Any references to third-party content is to identify the corresponding services and shall be considered fair use under The CopyrightLaw.
