A thermal stability study of alkane and aromatic thiolate self-assembled monolayers on copper surfaces

Abstract

The thermal stability of 1-decanethiol (C10) and benzenethiol (BT) Self-Assembled Monolayers (SAMs) on metallic and oxidized copper surfaces has been investigated by thermal desorption spectrometry. High quality C10 and BT SAMs exhibit low thermal stabilities on clean copper surfaces with a maximum in decomposition occurring between 100 and 150 ∘C. The decomposition of SAMs follows different mechanisms. For the alkanethiol, a direct interaction between the alkyl group of the thiolate and the metallic copper surface is the dominant pathway for the C–S bond scission. The head group desorbs as oxidized sulfur and this is followed by the desorption of the alkyl fragments of the chain adsorbed on the clean copper surface. In the case of benzenethiol, a simultaneous desorption of the head group as oxidized sulfur and the benzene group occurs. SAM formation on the oxidized copper surface results in complete removal and/or reduction of the CuO layer. Higher SAM surface coverages on the resulting Cu/Cu 2O surface result from the enhanced surface roughness of the substrate. The decomposition mechanisms and thermal stabilities of the C10 and BT SAMs are dependent on the oxidation state of the underlying substrate and the chemical nature of the chain.