Abstract
In response to the effect of global warming, increasing number of industries have focused their attention on green technology products such as the light-emitting diode (LED), currently has been widely applied in many products because of its low pollution potential, low power consumption, and long life characteristics. Panel type packaging (PTP) technology, applicable in a wafer level packaging process, is one of the solutions for LED packaging structure. However, LED with low electro-optical conversion efficiency converts a high-percentage of the input power into redundant heat; thus, junction temperature increases. In this research, the finite element (FE) model of the PTP technology was developed by commercial software ANSYS® for high-power LED mounted on metal-core printed circuit board (MCPCB), composed of copper foil, dielectric layer, and aluminum base plate. The forward-voltage method for characterization of diodes was also employed to measure the junction temperature of PTP for LED packaging, validated with the FE results. Next, the effects of MCPCB dielectric material, MCPCB size, filler material, and black bismaleimide triazine (BT) substrate material were analyzed. In addition, the multi-chip LED module was also investigated. By adopting the design guideline determined by the FE analysis, the thermal performance of the PTP technology for LED can be improved further, enhancing its suitability for high-power LED application.
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