Abstract
Using an exact solution for an elliptical hole in a perfectly plastic material, an expression is derived for the resistance of a ductile material undergoing subcritical crack propagation in the plane. This resistance curve is based on an analogy to the J-integral where an energy dissipation rate is determined rather than an energy release rate. The Tresca yield condition under plane stress loading conditions is employed in this derivation as well as finite deformation theory. This resistance curve is applicable to the initial stage of subcritical crack growth for a ductile material subject to crack tip blunting.
Talk to us
Join us for a 30 min session where you can share your feedback and ask us any queries you have
Disclaimer: All third-party content on this website/platform is and will remain the property of their respective owners and is provided on "as is" basis without any warranties, express or implied. Use of third-party content does not indicate any affiliation, sponsorship with or endorsement by them. Any references to third-party content is to identify the corresponding services and shall be considered fair use under The CopyrightLaw.