Abstract
Cryogenic aerosol‐based cleaning has been successfully used to remove contaminant particles from the surface of semiconductor wafers. The aerosol is generated by the expansion of an inert gas such as argon or nitrogen. Particles are dislodged by mechanical impact of the aerosol clusters, and their suspension and removal are effected by phenomena such as thermophoresis and turbulent lift in the flow stream over the wafer surface. This study presents a theoretical examination of the issues of aerosol generation and particle suspension and removal. The characteristics of aerosols generated in a freely expanding argon gas jet are studied using a coupled fluid flow‐cluster formation model. The role of thermophoresis in particle suspension and removal is studied by examining the relative strengths of thermal, diffusional, and gravitational effects in the boundary layer over the wafer surface. To the extent possible, theoretical findings are supported by experimental observations. © 1999 The Electrochemical Society. All rights reserved.
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