A Temperature Self-Adapting Heat Sink For Improving The Heat Dissipation Ability By Weakening The Dust Accumulation

Abstract

Thermal management of electronic equipment has been a key factor in the development of electronic devices. The fin heat sink is one of the most common types of heat dissipation in the industry. However, the shape of the cooling fins used in conventional straight fin heat sinks is usually fixed. The impurities such as dust and fibers in the air are likely to accumulate at the roots and edges of the cooling fins, blocking the heat dissipation path and reducing the heat dissipation efficiency. In this work, by coupling with Shape Memory Alloy (SMA), we propose a temperature self-adapting (TSA) heat sink, which has self-adapting fins to open and close as temperature changes. Compared with traditional fixed fin heat sink, this TSA heat sink can better adapt to the varying working conditions of electronic devices at different temperatures. The thermal performance and dustproof capability of the TSA heat sink were analyzed. As for a unit TSA heat sink, the cooling rate of the substrate can adjust itself as the heat source temperature increases. Under fouling conditions with American Society of Heating, Refrigerating and Air-Conditioning Engineers Standard Dust (ASHRAE Standard Dust), when the fouling was in the limit situation (full-filled), the substrate temperature of the conventional heat sink was 21.83% higher than that of the TSA heat sink, indicating that the TSA heat sink can play a better role in dustproof performance. This TSA heat sink provides a new adaptive structure of heat dissipation, which is conducive to the development of electronic devices.