Abstract

Background. Investigation of dynamic characteristics of circuit boards in design of instrument devices with the purpose of revealing their vibration relief, determining resonance frequencies and oscillation forms, and also analyzing their vibration resistance under external operational influences, is carried out. In this paper, a technique for determining the locations for installation of measuring devices on circuit boards, including the stage of mathematical modeling of their dynamic state, providing maximum information in the conduct of vibration tests, is proposed. Materials and methods. In the article, the circuit boards with hinged electronic components of instrument devices subject to harmonic vibration loading are considered. A technique for performing experimental and theoretical studies, based on preliminary mathematical modeling of the stress-strain state (SSS) of the circuit board under operational dynamic loads is developed. Modeling of the circuit board SSS is performed using the finite element method (FEM) implemented in ANSYS package, taking into account that the circuit board has a layered heterogeneous structure. Results. A technique that allows the detection of the most effective locations for measuring devices on circuit boards has been developed to obtain maximum information about SSS of the circuit board and its elements during the vibration testing. Conclusions. The conducted numerical studies have shown that the application of the proposed technique at the early stages of designing instrument devices suggests a significant increase in their vibration resistance, helps to reduce time and amount of the performed experimental work, and significantly reduce the economic costs of designing new and upgrading the existing instrument devices.

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