Abstract
Due to the complicated process and huge cost of a modern semiconductor wafer foundry, maintaining stable yield is very critical. If the yield killer is not identified, no containment actions can be taken; if there are no containment actions, the impact will continue and the yield loss will enlarge. In this paper, we have proposed a new systematic methodology for low yield excursion analysis. It integrated Kepner-Tregoe (KT) method and fishbone factor analysis to identify the real yield killer in an efficient and effective manner. From the real case application, it was proven that KT method and fishbone factor analysis can be integrated and resolved the issue successfully. This methodology has great potential to extend to other complicated and urgent daily management issues in a semiconductor fabrication plant.
Published Version
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