Abstract
In this paper, a methodology, and a program based on the methodology, are presented, which, using the reliability of solder joints for various values of design/process parameters, can be estimated in seconds on a personal computer. The proposed methodology accurately captures the behavior of a solder joint in an artificial neural network (ANN) model trained to relate design as well as analysis parameters to fatigue life. The proposed methodology is novel since such simultaneous analysis and design (SAND) procedures do not appear to have been employed until now for reliability estimation of solder joints. The use of Moire´ interferometry as an experimental technique to estimate the analysis-related inputs to the neutral network model is also presented in the paper. [S1043-7398(00)01101-4]
Talk to us
Join us for a 30 min session where you can share your feedback and ask us any queries you have
Schedule a callDisclaimer: All third-party content on this website/platform is and will remain the property of their respective owners and is provided on "as is" basis without any warranties, express or implied. Use of third-party content does not indicate any affiliation, sponsorship with or endorsement by them. Any references to third-party content is to identify the corresponding services and shall be considered fair use under The CopyrightLaw.
