Abstract
It is remarkably desirable and challenging to design a stretchable conductive material with tunable electromagnetic‐interference (EMI) shielding and heat transfer for applications in flexible electronics. However, the existing materials sustained a severe attenuation of performances when largely stretched. Here, a super‐stretchable (800% strain) liquid metal foamed elastomer composite (LMF‐EC) is reported, achieving super‐high electrical (≈104 S cm−1) and thermal (17.6 W mK−1) conductivities under a large strain of 400%, which also exhibits unexpected stretching‐enhanced EMI shielding effectiveness of 85 dB due to the conductive network elongation and reorientation. By varying the liquid and solid states of LMF, the stretching can enable a multifunctional reversible switch that simultaneously regulates the thermal, electrical, and electromagnetic wave transport. Novel flexible temperature control and a thermoelectric system based on LMF‐EC is furthermore developed. This work is a significant step toward the development of smart electromagnetic and thermal regulator for stretchable electronics.
Highlights
It is remarkably desirable and challenging to design a stretchable conductive communication and heat dissipation of electronics devices
Elastomer composites (EC), which include carbon nanotube (CNT),[9,10] graphene,[11] and metal particles.[12,13]. The former can achieve a superhigh EMI shielding effectiveness, but has a limited With the rapid development of flexible electronics[1] toward stretchable capacity due to the intrinsic rigid miniaturization and high-power densities, waste heat and elec- porous structure and was fractured in structure for a high tromagnetic interference (EMI) as inevitable byproducts, poses strain > 200%
We reported a super-stretchable (800% strain) LM-foamed elastomer composites (EC) (LMF-EC) consisted of a porous LM structure coated with the elastic composite of the silicon matrix
Summary
It is remarkably desirable and challenging to design a stretchable conductive communication and heat dissipation of electronics devices. The 3D conductive network of LMF constrained in the EC matrix was elongated and reorientated in the stretching direction to maintain its complete topological structure, and achieve outstanding stretching-enhanced electrical, thermal, and EMI shielding performances.
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