Abstract
This paper presents a microelectromechanical system (MEMS)-based oscillator based on a Lamé-mode capacitive micromachined resonator and a fully differential high-gain transimpedance amplifier (TIA). The proposed TIA is designed using TSMC 65 nm CMOS technology and consumes only 0.9 mA from a 1-V supply. The measured mid-band transimpedance gain is 98 dB and the TIA features an adjustable bandwidth with a maximum bandwidth of 142 MHz for a parasitic capacitance of 4 pF. The measured input-referred current noise of the TIA at mid-band is below 15 pA/. The TIA is connected to a Lamé-mode resonator, and the oscillator performance in terms of phase noise and frequency stability is presented. The measured phase noise under vacuum is −120 dBc/Hz at a 1-kHz offset, while the phase noise floor reaches −127 dBc/Hz. The measured short-term stability of the MEMS-based oscillator is ±0.25 ppm.
Highlights
Oscillators are of great interest because of their ubiquitous use in timing applications and in modern wireless communication devices
This paper presented a microelectromechanical systems (MEMS) oscillator based on a Lamé-mode capacitive MEMS resonator and a fully differential high-gain transimpedance amplifier (TIA)
The TIA was fabricated in a TSMC 65 nm CMOS process from TSMC and consumes 0.9 mW
Summary
Oscillators are of great interest because of their ubiquitous use in timing applications and in modern wireless communication devices. Sensors 2019, 19, 2680 other hand, capacitive bulk-mode devices typically exhibit lower transduction efficiencies compared to piezoelectric devices, which translate to higher losses and motional resistances This can be accounted for by either enhancing the transduction, e.g., sub-micron gaps realized by complex fabrication processes [11,12,13], high voltages [1,2,3,4,5,6,7,14], added transducer combs [15,16], movable electrodes for gap closing [17,18], or increasing the gain for the transimpedance amplifier (TIA). Measurement results are presented and discussed, and are followed by a conclusion
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