Abstract
Both metal-bonded (ELID) and resin-bonded diamond wheels were used in this study to grind silicon (100) wafers and efforts were made to investigate the characteristics of obtained surface integrity. The results showed that, depending on the wheel and machining conditions, amorphous layer, nanocrystals, polycrystals, dislocations and micro-cracks were observed in both cases. It was found that the ELID ground surfaces were very sensitive to the ELID parameters and the optimized conditions were difficult to obtain and be maintained. In the case of resin bond wheel, except when feedrate is very low (say 2μm/min) or wheel is loaded, the amorphous layer generated were normally thinner than those generated by ELID grinding under the same grinding conditions.KeywordsSingle Crystal SiliconAmorphous LayerDiamond WheelSubsurface DamageThick Oxide LayerThese keywords were added by machine and not by the authors. This process is experimental and the keywords may be updated as the learning algorithm improves.
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